Sintering kinetics of pure and doped boron carbide. Final technical report
The sintering of pure and doped boron carbide was investigated over the temperature range 1898/sup 0/ to 2380/sup 0/K and at additive levels ranging from 0.75 to 10.0 wt%. The addition of 0.75 and 3.8 wt% of AlF/sub 3/, Ni, Fe, and Cu resulted in a deactivation in the sintering of boron carbide at all temperatures. In contrast, the addition of 10.0 wt% of these dopants resulted in enhanced shrinkage in B/sub 4/C for the temperatures 1898m and 2133/sup 0/K. At the highest temperature, 2380/sup 0/K, the addition of AlF/sub 3/ at the 10.0 wt% level was the only case where enhanced shrinkage was observed. X-ray analysis showed the formation of a B/sub 12/C/sub 2/Al compound and the total release of the fluorine. These results are interpreted in terms of a grain-boundary diffusion process for pure and doped boron carbide.
- Research Organization:
- California Univ., Davis (USA). Dept. of Mechanical Engineering
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 6480379
- Report Number(s):
- UCRL-13894
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
ALLOYS
ALUMINIUM COMPOUNDS
ALUMINIUM FLUORIDES
BORON CARBIDES
BORON COMPOUNDS
CARBIDES
CARBON COMPOUNDS
COPPER ADDITIONS
COPPER ALLOYS
CRYSTAL STRUCTURE
DIFFUSION
FABRICATION
FLUORIDES
FLUORINE COMPOUNDS
GRAIN BOUNDARIES
HALIDES
HALOGEN COMPOUNDS
IRON ADDITIONS
IRON ALLOYS
MICROSTRUCTURE
NICKEL ADDITIONS
NICKEL ALLOYS
SINTERING
VERY HIGH TEMPERATURE
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
ALLOYS
ALUMINIUM COMPOUNDS
ALUMINIUM FLUORIDES
BORON CARBIDES
BORON COMPOUNDS
CARBIDES
CARBON COMPOUNDS
COPPER ADDITIONS
COPPER ALLOYS
CRYSTAL STRUCTURE
DIFFUSION
FABRICATION
FLUORIDES
FLUORINE COMPOUNDS
GRAIN BOUNDARIES
HALIDES
HALOGEN COMPOUNDS
IRON ADDITIONS
IRON ALLOYS
MICROSTRUCTURE
NICKEL ADDITIONS
NICKEL ALLOYS
SINTERING
VERY HIGH TEMPERATURE