Multi-wire slurry wafering demonstrations

Technical Report · Wed Feb 22 04:00:00 EST 1978

DOI:https://doi.org/10.2172/6476377· OSTI ID:6476377

Chen, C P

A series of ten slicing demonstrations on a multi-wire slurry saw, manufactured by Yasunaga Engineering Company of Japan and distributed by GEOS Corporation of Stamford, Connecticut, was made to evaluate the silicon ingot wafering capabilities. The results revealed that the present sawing capabilities can provide usable wafer area from an ingot 1.05 m/sup 2//kg (e.g., kerf width 0.135 mm and wafer thickness 0.265 mm). Satisfactory surface qualities and excellent yield of silicon wafers were found. One drawback is that the add-on cost of producing wafer from this saw, as presently used, is considerably higher than the systems being developed by Varian and Crystal Systems for the Low-Cost Silicon Solar Array Protect (LSSA), Task II, primarily because the Yasunaga saw uses a large quantity of wire. The add-on cost can be significantly reduced by extending the wire life and/or by reuse of properly plated wire to restore the diameter.

• Research Organization: Jet Propulsion Lab., Pasadena, CA (USA)
• OSTI ID: 6476377
• Report Number(s): DOE/JPL/1012-78/7; JPL-PUB-78-37
• Country of Publication: United States
• Language: English

Related Subjects

14 SOLAR ENERGY
140501* -- Solar Energy Conversion-- Photovoltaic Conversion
36 MATERIALS SCIENCE
360601 -- Other Materials-- Preparation & Manufacture
COST
CUTTING
CUTTING TOOLS
DIRECT ENERGY CONVERTERS
DISPERSIONS
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
ELEMENTS
MACHINING
MIXTURES
PERFORMANCE TESTING
PHOTOELECTRIC CELLS
PHOTOVOLTAIC CELLS
PHYSICAL PROPERTIES
SEMIMETALS
SILICON
SILICON SOLAR CELLS
SLURRIES
SOLAR CELLS
SPECIFICATIONS
SURFACE PROPERTIES
SUSPENSIONS
TESTING
TOOLS
WIRES