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Amine plasma modification of polyaramid filaments

Conference ·
OSTI ID:6463555
Amine plasmas offer a method to implant amine groups into the surface structure of polyaramid filaments. These amines will react with epoxy to form covalent bonds at composite interfaces. They may also be chemically modified for reaction with other polymerizing matrices. The covalently bound interface exhibits an increased resistance to peel forces. Fractured surfaces show a change in failure mode from interface dominated to a mixture of filament splitting and matrix cracking as amine content is increased. Thus, the weak link in determining off-axis strengths of polyaramid/epoxy is changed from the interface to the filament and matrix bulk strengths after amination. The covalently bonded interface should also exhibit improved hygrothermal stability. The kinetics of amination are rapid - surface saturation occurs in 30 s; however, the kinetics are sensitive to oxygen concentration. Filament tensile strength is unchanged by amine plasma treatment times less than 600 s. Spectroscopic analysis indicates that the surface structure may, nevertheless, be substantially altered.
Research Organization:
Massachusetts Inst. of Tech., Cambridge (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6463555
Report Number(s):
SAND-82-2233C; CONF-830303-9; ON: DE83005197
Country of Publication:
United States
Language:
English