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Title: HIgh-temperature electrical conductivity and thermal decomposition of Sylgard 184 and 184/GMB

Technical Report ·
OSTI ID:6463448

These properties were determined to 600 to 700/sup 0/C in air and nitrogen environments. The material is a silicone-based dielectric and is used as an encapsulant for electronic components. The 184/GMB material contains glass microballoons. The thermal decomposition characteristics were determined from mass loss and vaporization species (mass spectroscopy) measurements. Results show only minor weight loss in air up to 300/sup 0/C and in nitrogen to 400/sup 0/C. There is a peak in the conductivity at approx. 300/sup 0/C which results from the volatilization of (Si (CH/sub 3/))/sub n/ with some dehydration. At and above 400/sup 0/C, weight loss is much more pronounced and the conductivity is dependent upon the atmosphere and upon the presence of glass microballoons. The conductivity characteristics in air are similar to those in nitrogen, except there is a peak in air at 490 to 530/sup 0/C due to combustion and there is a shift to lower temperatures. This indicates that the oxygen accelerates decomposition. 184/GMB exhibits an enhanced conductivity above approx. 500/sup 0/C. Similar results are observed for materials with islica microballoons (184/GMB-S) and ceramic microballoons (184/CMB). This suggests that the microballons may help form a network of interconnected conductive pathways in the residual material. The material without microballoons is highly fractured. 18 figures, 5 tables.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6463448
Report Number(s):
SAND-82-1283; ON: DE83005810
Country of Publication:
United States
Language:
English