LARC-TPI and new thermoplastic polyimides
Journal Article
·
· SAMPE J.; (United States)
OSTI ID:6452152
The LARC-TPI linear thermoplastic polyimide has been developed by NASA for high temperature adhesive applications in aerospace structures in the forms of varnish, films, powders, and prepregs. LARC-TPI improves adhesive processability and lowers glass transition temperature, while retaining mechanical, thermal and electrical properties inherent in the polyimides. It may be used as a structural adhesive for metals, composites, ceramics, and films. 8 references.
- Research Organization:
- Mitsui Toatsu Chemicals, Inc., Tokyo, Japan
- OSTI ID:
- 6452152
- Journal Information:
- SAMPE J.; (United States), Vol. 23
- Country of Publication:
- United States
- Language:
- English
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