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Title: Advanced cooling techniques for fastbus electronics

Technical Report ·
OSTI ID:6436849

FASTBUS is a standardized, modular, data-bus system for data acquisition, data processing and control. Some of the high energy physics research centers which use FASTBUS include Fermilab in Batavia, Illinois, Brookhaven National Laboratories in New York, and the European Organization for Nuclear Research, CERN, in Geneva, Switzerland. Although numerous other locations throughout the world use FASTBUS, it is from these locations that information was gathered and will be discussed in this report. FASTBUS provides a standardized format for both software and hardware design, such that system users worldwide can exchange information and developments among various high energy physics research locations without encountering incompatibility. Since this report is primarily concerned with the cooling aspects of FASTBUS electronics, only the mechanical hardware design limitations will be discussed. Modular components which are of concern to a cooling system are the crate and electronics boards (known as the Module) inserted into it.

Research Organization:
Illinois Univ., Urbana (USA). Dept. of Physics
DOE Contract Number:
AC02-76ER01195
OSTI ID:
6436849
Report Number(s):
DOE/ER/01195-501-1; ON: DE86002464
Resource Relation:
Other Information: Portions of this document are illegible in microfiche products. Thesis
Country of Publication:
United States
Language:
English