The kinetics of tungsten etching by atomic and molecular chlorine
- Univ. of California, Berkeley, CA (US)
- Lawrence Livermore National Lab., Livermore, CA (US)
The reactions of atomic and molecular chlorine with tungsten were studied by modulated beam-mass spectrometric methods over the temperature range 300-1350 K. The atomic beam was generated by an RF plasma discharge. With both atomic and molecular beams, the main reaction product up to about 1000 K was WCl/sub 4/. The reaction probability with atomic chlorine was a factor of approximately ten higher than that obtained with molecular chlorine. The reaction was nonlinear with respect to Cl/sub 2/ intensity at low beam fluxes but approached linearity at high beam intensities. Above 1000 K the main reaction product was atomic chlorine. Its reaction probability increased rapidly with temperature; at 1300 K nearly complete dissociation of Cl/sub 2/ was observed. A kinetic model based on the Eley-Rideal mechanism was proposed and compared with the data.
- OSTI ID:
- 6433824
- Journal Information:
- J. Electrochem. Soc.; (United States), Journal Name: J. Electrochem. Soc.; (United States) Vol. 135:8; ISSN JESOA
- Country of Publication:
- United States
- Language:
- English
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75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ATOMIC BEAMS
BEAMS
CHEMICAL REACTION KINETICS
CHEMICAL REACTION YIELD
CHLORINE
ELEMENTS
ETCHING
HALOGENS
HIGH TEMPERATURE
KINETICS
MASS SPECTROMETERS
MEASURING INSTRUMENTS
METALS
MOLECULAR BEAMS
NONMETALS
PLASMA
REACTION KINETICS
RF SYSTEMS
SOLID-STATE PLASMA
SPECTROMETERS
SURFACE FINISHING
TRANSITION ELEMENTS
TUNGSTEN
YIELDS