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The kinetics of tungsten etching by atomic and molecular chlorine

Journal Article · · J. Electrochem. Soc.; (United States)
DOI:https://doi.org/10.1149/1.2096215· OSTI ID:6433824
; ;  [1];  [2]
  1. Univ. of California, Berkeley, CA (US)
  2. Lawrence Livermore National Lab., Livermore, CA (US)

The reactions of atomic and molecular chlorine with tungsten were studied by modulated beam-mass spectrometric methods over the temperature range 300-1350 K. The atomic beam was generated by an RF plasma discharge. With both atomic and molecular beams, the main reaction product up to about 1000 K was WCl/sub 4/. The reaction probability with atomic chlorine was a factor of approximately ten higher than that obtained with molecular chlorine. The reaction was nonlinear with respect to Cl/sub 2/ intensity at low beam fluxes but approached linearity at high beam intensities. Above 1000 K the main reaction product was atomic chlorine. Its reaction probability increased rapidly with temperature; at 1300 K nearly complete dissociation of Cl/sub 2/ was observed. A kinetic model based on the Eley-Rideal mechanism was proposed and compared with the data.

OSTI ID:
6433824
Journal Information:
J. Electrochem. Soc.; (United States), Journal Name: J. Electrochem. Soc.; (United States) Vol. 135:8; ISSN JESOA
Country of Publication:
United States
Language:
English