Cutting fluid study for single crystal silicon
An empirical study was conducted to evaluate cutting fluids for Single Point Diamond Turning (SPDT) of single crystal silicon. The pH of distilled waster was adjusted with various additives the examine the effect of pH on cutting operations. Fluids which seemed to promote ductile cutting appeared to increase tool wear as well, an undesirable tradeoff. High Ph sodium hydroxide solutions showed promise for further research, as they yielded the best combination of reduced tool wear and good surface finish in the ductile regime. Negative rake tools were verified to improve the surface finish, but the negative rake tools used in the experiments also showed much higher wear than conventional 0{degree} rake tools. Effects of crystallographic orientation on SPDT, such as star patterns of fracture damage forming near the center of the samples, were observed to decrease with lower feedrates. Silicon chips were observed and photographed, indicative of a ductile materials removal process.
- Research Organization:
- Lawrence Livermore National Lab., CA (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 641101
- Report Number(s):
- UCRL-ID--130754; ON: DE98057699; CNN: W-7405-Eng-48
- Country of Publication:
- United States
- Language:
- English
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