Electroplating film-forming metals in non-aqueous electrolyte
Metals such as lead, silver, copper, calcium, antimony, cadmium, nickel and zinc are electroplated onto a film-forming metal substrate from the group of aluminium, titanium, zirconium, niobium, molybdenum, tungsten, tantalum and alloys thereof, using an etching/electroplating solution comprising ions of the metal(s) to be plated, optionally alkali metal ions, aluminium halide and an aromatic hydrocarbon. Surface oxide is removed from the film-forming metal substrate by reaction with the aluminium halide and the metal(s) in solution to form soluble complexes, this possibly being assisted by anodization. This is followed by cathodically connecting the substrate and passing current to electroplate the metal(s) onto the oxide-free surface, directly in the same etching/electroplating solution.
- Assignee:
- Diamond Shamrock Chemicals Company
- Patent Number(s):
- US 4465561
- OSTI ID:
- 6401916
- Resource Relation:
- Patent Priority Date: Priority date 16 Feb 1983, Switzerland; Other Information: PAT-APPL-467153
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
METALS
ELECTROPLATING
ANODIZATION
CATHODES
ELECTROLYSIS
ETCHING
FILMS
OXIDES
SOLID ELECTROLYTES
SUBSTRATES
CHALCOGENIDES
CHEMICAL COATING
CORROSION PROTECTION
DEPOSITION
ELECTROCHEMICAL COATING
ELECTRODEPOSITION
ELECTRODES
ELECTROLYTES
ELEMENTS
LYSIS
OXYGEN COMPOUNDS
PLATING
SURFACE COATING
SURFACE FINISHING
360101* - Metals & Alloys- Preparation & Fabrication