Effects of vacuum processing erbium dideuteride/ditritide films deposited on chromium underlays on copper substrates

Journal Article · Thu Mar 01 04:00:00 EST 1979 · J. Vac. Sci. Technol.; (United States)

DOI:https://doi.org/10.1116/1.569915· OSTI ID:6401849

Provo, J L

Thin films of erbium dideuteride/ditritide have been experimentally produced on chromium underlays deposited on copper substrates. The chromium underlay is required to prevent erbium occluder/copper substrate alloying which inhibits hydriding. Data taken has shown that vacuum processing affects the erbium/chromium/copper interaction. With an in situ process in which underlay/occluder films are vacuum deposited onto copper substrates and hydrided with no air exposure between these steps, data indicates a minimum of 1500 A of chromium is required for optimum hydriding. If films are vacuum deposited as above and air-exposed before hydriding, a minimum of 3000 A of chromium was shown to be required for equivalent hydriding. Data suggests that the activation step (600/sup 0/C for 1 h) required for hydriding the film of the second type is responsible for the difference observed. Such underlay thickness parameters are important, with regard to heat transfer consideration in thin film hydride targets used for neutron generation.

• Research Organization: General Electric Company, Neutron Devices Department, St. Petersburg, Florida 33733
• OSTI ID: 6401849
• Journal Information: J. Vac. Sci. Technol.; (United States), Journal Name: J. Vac. Sci. Technol.; (United States) Vol. 16:2; ISSN JVSTA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
CHEMICAL REACTIONS
CHROMIUM
COPPER
DEPOSITION
DEUTERIDES
DEUTERIUM COMPOUNDS
ELEMENTS
ERBIUM COMPOUNDS
ERBIUM HYDRIDES
FABRICATION
FILMS
HYDRIDATION
HYDRIDES
HYDROGEN COMPOUNDS
LABELLED COMPOUNDS
METALS
RARE EARTH COMPOUNDS
SURFACE COATING
TRANSITION ELEMENTS
TRITIUM COMPOUNDS
VACUUM COATING