Finite element modeling of the effect of interface anomalies on thermal stresses in alumina scales
- Lockheed Martin Idaho Technologies Co., Idaho Falls, ID (United States). Idaho National Engineering and Environmental Lab.
- Lawrence Berkeley National Lab., CA (United States)
- Argonne National Lab., IL (United States)
The scales that grow from oxidation often develop a convoluted morphology or interface pores. High thermal stresses can develop locally and are potentially detrimental to the scale or interface integrity. Finite element simulations are used to examine residual thermal stresses and strains that result when these deviations from a flat interface have formed, and the resulting geometry is subsequently cooled to room temperature. A variety of geometries will be considered for alumina scales on a FeCrAl substrate.
- Research Organization:
- Lockheed Martin Idaho Technologies Co., Idaho National Engineering and Environmental Lab., Idaho Falls, ID (United States); Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Organization:
- USDOE Assistant Secretary for Energy Efficiency and Renewable Energy, Washington, DC (United States)
- DOE Contract Number:
- AC07-94ID13223; AC03-76SF00098; W-31109-ENG-38
- OSTI ID:
- 639753
- Report Number(s):
- INEEL/CON-98-00046; CONF-980504-; ON: DE98056062; TRN: AHC29816%%59
- Resource Relation:
- Conference: 193. meeting of the Electrochemical Society, Inc., San Diego, CA (United States), 3-8 May 1998; Other Information: PBD: [1998]
- Country of Publication:
- United States
- Language:
- English
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