Metallographic preparation of pressed and sintered powder-metallurgy material (tungsten, niobium, lead, and copper)
An object of this invention is to provide a metallographic preparation procedure for obtaining a flat and scratch-free surface of a representative sample of a pressed and sintered powder-metallurgy material. A further object of this invention is to provide a metallographic preparation procedure for obtaining a flat and scratch-free surface of a representative sample of a pressed and sintered powder-metallurgy material comprised of a composite of the refractory metals tungsten and columbium and the soft metals lead and copper. The representative samples of Table I contain hard and soft constituents. The hard constituents are refractory metals of tungsten and niobium, and the soft constituents are soft metals of copper and lead. All samples were selected and cut from parent material and encapsulated in epoxy resin prior to polishing, Stage A. The encapsulation enabled the sample to be held during grinding and polishing for the metallographic preparation technique disclosed by the additional Stages B-E and steps outlined below.
- Assignee:
- Dept. of the Army, Washington, DC
- Patent Number(s):
- None
- OSTI ID:
- 6326640
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
360101* -- Metals & Alloys-- Preparation & Fabrication
ALLOYS
COMMINUTION
COPPER
ELEMENTS
ENCAPSULATION
FABRICATION
GRINDING
LEAD
MACHINING
MATERIALS
METALLOGRAPHY
METALLURGY
METALS
NIOBIUM
POLISHING
POWDER METALLURGY
POWDERS
REFRACTORY METALS
SAMPLING
SINTERING
SURFACE FINISHING
TRANSITION ELEMENTS
TUNGSTEN