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Gaseous contaminants modify the friction and wear response of precious metal electrical contact alloys

Conference ·
OSTI ID:6326007

An in-situ electrical contact resistance and friction coefficient measuring device has been installed in a scanning Auger microprobe. A pin-on-plate experimental configuration is used. This tribology system has been used to characterize the friction, wear and electrical contact resistance of a Pd alloy pin (ASTM B540) sliding on a Au alloy plate (ASTM B541). Studies have been completed with and without H/sub 2/S in the atmosphere for wear in 1.6 x 10/sup -6/ torr O/sub 2/, 700 torr of 5% O/sub 2/ in N/sub 2/ and 700 torr He. The presence of H/sub 2/S reduces the friction coefficient and decreases the wear track width on the Au alloy. The lower friction is associated with adsorption and reaction of the H/sub 2/S with the Au alloy plate. In the ambients containing H/sub 2/S, large accumulations of S in wear tracks are observed; however, no increase in the electrical contact resistance occurs. In the 700 torr ambients containing H/sub 2/S, Cu segregates to the wear track surfaces to the exclusion of the other metallic elements and forms Cu/sub 2/S layers. A concomitant shift occurs in the S and Cu Auger peak positions when the Cu/sub 2/S film thickens.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6326007
Report Number(s):
SAND-86-2796C; CONF-870960-1; ON: DE87007862
Country of Publication:
United States
Language:
English