Stress singularities at the interface in bonded dissimilar materials under mechanical and thermal loading

Journal Article · Mon Nov 30 23:00:00 EST 1992 · Journal of Applied Mechanics (Transactions of the ASME, Series E); (United States)

DOI:https://doi.org/10.1115/1.2894053· OSTI ID:6307448

Munz, D; Yang, Y Y ^[1]

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1. Karlsruhe Univ. (Germany)

A rectangular plate made of two bonded components with different elastic properties and subjected to mechanical loading is analyzed with respect to stress singularities at the interface. Two loading conditions are considered for a compound with 90-deg angles of the two materials: (1) the component is cooled down from a stress-free state, as occurs during soldering of a ceramic-metal joint and (2) the component is loaded by a tensile load sigma-infinity perpendicular to the interface. Finite element calculations for this compound showed that there exists a unique relationship between KI/sigma(0) for thermal loading or KI/sigma(infinity) for mechanical loading and the singularity exponent omega. It is shown that, for thermal loading, the stresses near the free edge of the interface do not increase with increasing omega. A large effect of the component size on the stress at the free edge of the interface was observed, especially for thermal loading. 4 refs.

• OSTI ID: 6307448
• Journal Information: Journal of Applied Mechanics (Transactions of the ASME, Series E); (United States), Journal Name: Journal of Applied Mechanics (Transactions of the ASME, Series E); (United States) Vol. 59:4; ISSN 0021-8936; ISSN JAMCAV
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360603* -- Materials-- Properties
BONDING
CALCULATION METHODS
COMPOSITE MATERIALS
FABRICATION
FINITE ELEMENT METHOD
INTERFACES
JOINING
JOINTS
MATERIALS
MECHANICAL PROPERTIES
NUMERICAL SOLUTION
PLATES
SINGULARITY
STATIC LOADS
STRESS ANALYSIS
STRESSES
TENSILE PROPERTIES
THERMAL STRESSES