Ceramic transactions: Materials in microelectronic and optoelectronic packaging. Volume 33

Conference · Fri Jan 01 04:00:00 EST 1993

OSTI ID:6267844

Ling, Hung C; Niwa, Koichi; Shukla, V N ^[1]

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1. eds.

This volume contains a collection of papers presented at the International Symposium on Materials for Microelectronic and Optoelectronic Packaging, held at the Third Ceramic Science and Technology Congress, San Francisco, CA, November 1-4, 1992. This symposium was cosponsored by the Electronics Division of the American Ceramic Society and the Ceramic Society of Japan. Forty-three papers were presented at the conference, addressing major areas of optoelectronic packaging, microelectronic packaging, processing/structure/properties, characterization techniques, and thick film/metallization technology. Thirty-six papers were peer reviewed and are included in this volume. Individual abstracts are provided for each paper.

• OSTI ID: 6267844
• Report Number(s): CONF-921128--; ISBN: 0-944904-63-7
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360200* -- Ceramics
Cermets
& Refractories
42 ENGINEERING
426000 -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ABSTRACTS
CERAMICS
DOCUMENT TYPES
ELECTRO-OPTICAL EFFECTS
EQUIPMENT
LEADING ABSTRACT
MECHANICAL PROPERTIES
MICROELECTRONICS
MICROSTRUCTURE
OPTICAL EQUIPMENT
PACKAGING
PHYSICAL PROPERTIES
PROCESSING
USES