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Title: Multispectral Focal Plane Assembly for Satellite Remote Sensing

Conference ·
OSTI ID:622892
 [1];  [2]
  1. Sandia National Labs., Albuquerque, NM (United States)
  2. Santa Barbara Research Center, Goleta, CA (United States)

Sandia National Laboratories and several subsystem contractors are developing technologies applicable to multispectral remote sensing from space. A proof of concept multispectral sensor system is under development. The objective of building this sensor is to demonstrate and evaluate multispectral imaging technologies for various applications. The three major subsystems making up the sensor are the focal plane assembly (FPA), the cryocooler, and the telescope. This paper covers the focal plane assembly, which is the basis of the sensor system. The focal plane assembly includes sensor chip assemblies, optical filters, and a vacuum enclosure with cold shielding. Linear detector arrays provide spatial resolution in the cross-track direction for a pushbroom imager configuration. The optical filters define 15 spectral bands in a range from 0.45 microns to 10.7 microns. All the detector arrays are mounted on a single focal plane and are designed to operate at 75 K. No beam splitters are used. The four spectral bands covering the visible to near infrared have roughly 2400 pixels each, and the remaining 11 spectral bands have roughly 600 pixels each. The average total rate of multispectral data from the FPA is approximately 15.4 megapixels per second. At the time this paper is being written, the multispectral focal plane assembly is in the fabrication phase. A thermal/mechanical mockup has been built and tested for the vibration environment and to determine the thermal load. Some of the sensor chip assemblies and filters have been built and tested. Several notable features of the design are covered in the paper as well as preliminary test data.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
622892
Report Number(s):
SAND-97-2481C; CONF-980319-; ON: DE98000387; TRN: AD-a339 968
Resource Relation:
Conference: 1998 Institute of Electrical and Electronics Engineers (IEEE) aerospace conference, Snowmass, CO (United States), 21-28 Mar 1998; Other Information: PBD: 1997
Country of Publication:
United States
Language:
English