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Interaction of Cu overlayers with W(001) studied by low-energy alkali ion scattering

Journal Article · · J. Vac. Sci. Technol., A; (United States)
DOI:https://doi.org/10.1116/1.575990· OSTI ID:6185076
Low-energy alkali ion scattering, Auger electron spectroscopy, and low-energy electron diffraction have been used to study the structure of ultrathin Cu overlayers on W(100). Incident polar and azimuthal angular scans of the Cu and W single-scattering intensity have been obtained as a function of Cu coverage and annealing temperature, and are used to evaluate various models for the surface structure. Dosing submonolayer amounts of Cu near room temperature results in two-dimensional islands of Cu bonded in fourfold hollows and some dispersed Cu atoms. Annealing at 1000 K causes irreversible displacement of first-layer W atoms and Cu incorporation, as indicated by a pronounced shift in the Li/sup +//W low-angle shadowing edge, and the changes in the shape of the Li/sup +//Cu edge. This result is interesting in view of the immiscibility of Cu and W. Analysis of contour plots of the Li/sup +//Cu single scattering support a growth of up to two pseudomorphic layers of Cu on W(001); although there is Cu and W mixing at the interface.
Research Organization:
Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
OSTI ID:
6185076
Journal Information:
J. Vac. Sci. Technol., A; (United States), Journal Name: J. Vac. Sci. Technol., A; (United States) Vol. 7:3; ISSN JVTAD
Country of Publication:
United States
Language:
English