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Title: Dynamic high-temperature-phosphor thermometry

Technical Report ·
DOI:https://doi.org/10.2172/6179976· OSTI ID:6179976

Dynamic surface phosphor thermometry is being investigated as part of a continuing effort by the Applied Technology Division (ATD) at Oak Ridge National Laboratory (ORNL) to develop and apply thermographic phosphor technology to an ever expanding thermometry field. The purpose of this program is to develop dynamic surface phosphor thermometry to a stage where funding proposals can be strengthened by establishing a strong information base and demonstrating a sound capability. As a new technology development in an area well established by ATD/ORNL, dynamic thermometry is extremely important for high-temperature materials, superconducting materials, advanced turbomachinery, space vehicles, industrial process equipment, and other development areas. This laboratory project illustrated the technique of continuously monitoring dynamic temperature excursions using phosphor thermography. Temperature-increase rates on the order of 100 or more degrees centigrade per millisecond were measured, which illustrated a temporal response of >0.001 s. This exceeded by a factor of ten the goal or the project and gave strong encouragement for further development of the technology. Important to the project, too, was the establishment of a clear analytical base for fluorescent-ratio data. Using the results of this study, specific solutions to dynamic-temperature-measurement problems in many application areas can be developed. In addition, the dynamic-thermographic technology can be coupled with strain measurement, two-dimensional analysis, and thermometry at very high temperatures to add interrelating remote measurement tools for systems that currently cannot be effectively studied. 13 refs., 11 figs.

Research Organization:
Oak Ridge National Lab., TN (USA). Applied Technology Div.
Sponsoring Organization:
DOE/ER
DOE Contract Number:
AC05-84OR21400
OSTI ID:
6179976
Report Number(s):
ORNL/ATD-43; ON: DE91005632
Country of Publication:
United States
Language:
English