Segregation and domain structure in rapidly solidified Ni/sub 3/Al

Journal Article · Sat Jan 01 04:00:00 EST 1983 · Proc. - Annu. Meet., Electron Microsc. Soc. Am.; (United States)

OSTI ID:6176980

Horton, J A; Koch, C C; Liu, C T

Rapid solidification processing (RSP) in conjunction with microalloying is being used to enhance the ductility of Ni/sub 3/Al. Boron which strengthens grain boundaries was added for significant improvement in ductility of Ni/sub 3/Al. Specimens of Ni/sub 3/Al (24 at. % Al) with additions of 0, 500, and 1000 wt ppm boron were splat-cooled in an arc-hammer apparatus. The specimens without boron were brittle while specimens with boron were ductile for all but the fastest quench rates. Microstructural characterization was performed with a Philips EM400T/FEG and JEM 120CX transmission electron microscopes.

• Research Organization: Oak Ridge National Lab., TN
• DOE Contract Number: W-7405-ENG-26
• OSTI ID: 6176980
• Journal Information: Proc. - Annu. Meet., Electron Microsc. Soc. Am.; (United States), Journal Name: Proc. - Annu. Meet., Electron Microsc. Soc. Am.; (United States) Vol. 41; ISSN EMSPA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360102 -- Metals & Alloys-- Structure & Phase Studies
360103* -- Metals & Alloys-- Mechanical Properties
ADDITIVES
ALLOYS
ALUMINIUM ALLOYS
BORON ADDITIONS
BORON ALLOYS
CRYSTAL STRUCTURE
DOMAIN STRUCTURE
DUCTILITY
INTERMETALLIC COMPOUNDS
MECHANICAL PROPERTIES
MICROSTRUCTURE
NICKEL ALLOYS
PHASE TRANSFORMATIONS
SEGREGATION
SOLIDIFICATION
TENSILE PROPERTIES