Low temperature joining of ceramic composites

Patent · Tue Jul 13 00:00:00 EDT 1999

OSTI ID:6175114

Barton, T J; Anderson, I E; Ijadi-Maghsoodi, S; Nosrati, M; Unal, O

A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or ceramic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 C to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix. 3 figs.

• Sponsoring Organization: USDOE; USDOE, Washington, DC (United States)
• DOE Contract Number: W-7405-ENG-82
• Assignee: Iowa State Univ. Research Foundation, Inc., Ames, IA (United States)
• Patent Number(s): US 5922628; A
• Application Number: PPN: US 9-028591
• OSTI ID: 6175114
• Resource Relation: Patent File Date: 23 Feb 1998
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BONDING
CERAMICS
COMPOSITE MATERIALS
HEATING
JOINTS
MECHANICAL PROPERTIES
MICROSTRUCTURE
SILICON CARBIDES
TEMPERATURE RANGE 1000-4000 K
CARBIDES
CARBON COMPOUNDS
FABRICATION
JOINING
MATERIALS
SILICON COMPOUNDS
TEMPERATURE RANGE
360201* - Ceramics
Cermets
& Refractories- Preparation & Fabrication