Thermal stability of extrinsic dislocations in near {Sigma}11 grain boundaries in nickel

Journal Article · Mon Mar 02 00:00:00 EST 1998 · Acta Materialia

DOI:https://doi.org/10.1016/S1359-6454(97)00361-3· OSTI ID:616396

Swiatnicki, W A; Grabski, M W ^[1]; Poulat, S; Priester, L; Decamps, B ^[2]

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1. Warsaw Univ. of Technology (Poland). Faculty of Materials Science and Engineering
2. Univ. Paris Sud, Orsay (France). Lab. de Metallurgie Structurale

Thermal stability of the extrinsic grain boundary dislocations (EGBDs) in near {Sigma}11 grain boundaries (GBs) has been investigated in nickel bicrystal thin foils containing different levels of impurities. The geometrical (GB misorientation and plane-GB steps) and chemical (segregation) factors which may affect the EGBD relaxation have been considered. The results show that the EGBD accommodation kinetics depends strongly on the segregation level, related to the GB plane orientation, and on the EGBD line orientation in the GB plane. They are mainly interpreted in terms of intergranular diffusion. They support the conclusion that no geometrical criterion can predict GB behavior, particularly in presence of GB segregation.

• OSTI ID: 616396
• Journal Information: Acta Materialia, Vol. 46, Issue 5; Other Information: PBD: 2 Mar 1998
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
NICKEL
GRAIN BOUNDARIES
DISLOCATIONS
SEGREGATION
GRAIN ORIENTATION