Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Extraction of kinetic parameters for the chemical vapor deposition of polycrystalline silicon at medium and low pressures

Journal Article · · Journal of the Electrochemical Society; (United States)
DOI:https://doi.org/10.1149/1.2220770· OSTI ID:6154972
;  [1]
  1. Univ. of Twente, Enschede (Netherlands). Faculty of Electrical Engineering
The deposition of silicon (Si) from silane (SiH[sub 4]) was studied in the silane pressure range from 0.5 to 100 Pa (0.005 to 1 mbar) and total pressure range from 10 to 1,000 Pa using N[sub 2] or He as carrier gases. The two reaction paths, namely, heterogeneous and homogeneous decomposition could be separated by varying the amount of wafer area per unit volume (wafer-distance variation) and the SiH[sub 4] partial pressure as well as the total pressure. Rate constants were derived by fitting the experimental results. The heterogeneous reaction path could be described by only the adsorption rate constants of reactive species and the desorption rate constant of hydrogen using a Langmuir-Hinshelwood mechanism. Hydrogen and phosphine were found to suppress the deposition rate at low silane pressures. At high silane pressures or high total pressures the unimolecular decomposition of silane dominates. The unimolecular rate constant was found to be one to two orders larger than literature values based on RRKM analyses of high pressure rate data. The relative efficiency of SiH[sub 4]-N[sub 2] and SiH[sub 4]-He collisions compared with SiH[sub 4]-SiH[sub 4] collisions in the unimolecular gas-phase decomposition of SiH[sub 4] has been investigated. Helium was found to be a weak collider compared to silane and nitrogen.
OSTI ID:
6154972
Journal Information:
Journal of the Electrochemical Society; (United States), Journal Name: Journal of the Electrochemical Society; (United States) Vol. 140:7; ISSN JESOAN; ISSN 0013-4651
Country of Publication:
United States
Language:
English