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Kinetics and mechanism of selective tungsten deposition by LPCVD

Journal Article · · J. Electrochem. Soc.; (United States)
DOI:https://doi.org/10.1149/1.2113664· OSTI ID:6145396

Tungsten films have been deposited selectively on oxide-patterned silicon wafers by the H/sub 2/ reduction of WF/sub 6/ in WF/sub 6//sup -/H/sub 2/ and WF/sub 6//sup -/H/sub 2//sup -/Ar gas flow systems. The deposition rate of films was investigated a a function of reactant partial pressures. The reaction orders with respect to WF/sub 6/ and H/sub 2/ are zero and one-half, respectively. Under given experimental conditions, the growth rate of the selectively deposited W films was reduced by 32% when the deposition area increased by a factor of 10-100. This decrease in growth rate can be attributed to the effect of HF on the surface reaction. The selective nature of the process deteriorates with increasing deposition rate, WF/sub 6/ partial pressure, H/sub 2/ partial pressure, or deposition time. The loss of selectivity seems to be linked to an increase in HF partial pressure in the reactor.

Research Organization:
Centre National d'Etudes des Telecommunications, Meylan
OSTI ID:
6145396
Journal Information:
J. Electrochem. Soc.; (United States), Journal Name: J. Electrochem. Soc.; (United States) Vol. 132:11; ISSN JESOA
Country of Publication:
United States
Language:
English