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Copper sulfide films deposited by cylindrical magnetron reactive sputtering

Journal Article · · J. Vac. Sci. Technol.; (United States)
DOI:https://doi.org/10.1116/1.569907· OSTI ID:6141539
Copper sulfide coatings 150 nm thick were deposited by reactive sputtering using a copper cylindrical magnetron sputtering source in an Ar--H/sub 2/S atmosphere at constant discharge current and varies H/sub 2/S injection rates. Borosilicate plate-substrates were maintained at temperatures of 130/sup 0/ and 35/sup 0/C, which are above and below transition temperatures for the Cu/sub x/S phases of interest. Above a critical injection rate resistivity data indicate two types of materials: a high-resistivity type (approx.100 ..cap omega.. cm) often exhibiting Cu-rich nodules, and a low-resistivity type (approx.0.01 ..cap omega.. cm). The types are generally associated with the high and low substrate temperatures respectively. Hall mobilities were in the 1--6 cm/sup 2//V s range for both materials. Optical absorption, resistivity-versus-temperature, and x-ray diffraction measurements indicate that the high resistivity material consists largely of near-stoichiometric chalcocite and that the low resistivity material is a mixture of chalcocite and djurleite.
Research Organization:
Lockheed Palo Alto Research Laboratory, Palo Alto, California 94304
OSTI ID:
6141539
Journal Information:
J. Vac. Sci. Technol.; (United States), Journal Name: J. Vac. Sci. Technol.; (United States) Vol. 16:2; ISSN JVSTA
Country of Publication:
United States
Language:
English