Dynamic fatigue property of silicon carbide whisker-reinforced silicon nitride

Conference · Thu Aug 01 04:00:00 EDT 1991 · Ceramic Engineering and Science Proceedings; (United States)

OSTI ID:6107630

Choi, S R; Salem, J A; Gyekenyesi, J P

The dynamic fatigue behavior of 30 vol pct SiC whisker-reinforced silicon nitride was determined in flexure as a function of temperature from 1100 to 1300 C in an air environment. The fatigue susceptibility parameter n decreased from 88.1 to 20.1 with increasing temperature from 1100 to 1300 C. A transition in the dynamic fatigue curve occurred at a lowest stressing rate of 2 MPa/min at a temperature of 1300 C, resulting in a considerably lower value of n = 5.8. This transition was primarily due to creep that was enhanced by a combination of high temperature and very slow deformation rate. The fatigue resistance of natural flaws at 1100 C was found to be greater than that of artificial flaws produced by indentation. 27 refs.

• OSTI ID: 6107630
• Report Number(s): CONF-910162--
• Conference Information: Journal Name: Ceramic Engineering and Science Proceedings; (United States) Journal Volume: 12
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360603* -- Materials-- Properties
CARBIDES
CARBON COMPOUNDS
COMPOSITE MATERIALS
CREEP
CRYSTALS
DEFECTS
FATIGUE
FRACTOGRAPHY
HIGH TEMPERATURE
MATERIALS
MECHANICAL PROPERTIES
MONOCRYSTALS
NITRIDES
NITROGEN COMPOUNDS
PNICTIDES
REINFORCED MATERIALS
SILICON CARBIDES
SILICON COMPOUNDS
SILICON NITRIDES
THERMAL FATIGUE
WHISKERS