High flux heat exchanger. Interim report, 1 October 1990-29 October 1991
This interim report documents the results of the first two phases of a four-phase program to develop a high flux heat exchanger for cooling future high performance aircraft electronics. Phase I defines future needs for high flux heat removal in advanced military electronics systems. The results are sorted by broad application categories, which are: (1) commercial digital systems, (2) military data processors, (3) power processors, and (4) radar and optical systems. For applications expected to be fielded in five to ten years, the outlook is for steady state flux levels of 30-50 W/cm2 for digital processors and several hundred W/cm2 for power control applications. In Phase I, a trade study was conducted on emerging cooling technologies which could remove a steady state chip heat flux of 100 W/cm2 while holding chip junction temperature to 90 deg C. Constraints imposed on heat exchanger design, in order to reflect operation in a fighter aircraft environment, included a practical lower limit on coolant supply temperature, the preference for a nontoxic, nonflammable, and nonfreezing coolant, the need to minimize weight and volume, and operation in an accelerating environment. The trade study recommended the Compact High Intensity Cooler (CHIC) for design, fabrication, and test in the final two phases of this program.... Electronic Cooling, High Power Electronics.
- Research Organization:
- McDonnell Douglas Missile Systems Co., St. Louis, MO (United States)
- OSTI ID:
- 6093185
- Report Number(s):
- AD-A-266341/7/XAB; CNN: F33615-90-C-2054
- Country of Publication:
- United States
- Language:
- English
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