MOD silver metallization for photovoltaics. Quarterly technical report, September 1-November 30, 1984

Technical Report · Fri Dec 21 04:00:00 EST 1984

DOI:https://doi.org/10.2172/6086372· OSTI ID:6086372

Vest, G. M.; Vest, R. W.

Major areas of the metallization process were examined in order to determine whether or not a major ink chemistry change could be avoided by making relatively minor changes in the processing in order to give consistent excellent initial adhesion and long-term adhesion. All results suggested that the adhesion strength is very sensitive to the ink and its processing. It was also learned that the difference in surface roughness between alkali and acid etched solar cells does not have a significant effect on resulting film adhesion. In order to overcome the effects on adhesion of minor variations in the metallization process, a permanent binding agent in the form of a MOD compound was sought. Bismuth 2-ethylhexanoate proved to be suitable MOD compound which would impart consistent initial as well as long-term adhesion by decomposing to bismuth oxide in the fired films. The presence of bismuth oxide has significant detrimental effects on film sheet resistance such that multi-layer films will be more necessary than before. Finally, the processing of multi-layer films has presented some problems with film stability as multi-layer fired films have shown considerable cracking which destroys adhesion.

• Research Organization: Purdue Univ., Lafayette, IN (USA)
• DOE Contract Number: NAS-7-100-956679
• OSTI ID: 6086372
• Report Number(s): DOE/JPL/956679-84/4; ON: DE85006654
• Country of Publication: United States
• Language: English

Related Subjects

14 SOLAR ENERGY
140501* -- Solar Energy Conversion-- Photovoltaic Conversion
ADHESION
DIRECT ENERGY CONVERTERS
ELECTRODES
EQUIPMENT
ETCHING
GRIDS
PHOTOELECTRIC CELLS
PHOTOVOLTAIC CELLS
ROUGHNESS
SOLAR CELLS
SOLAR EQUIPMENT
SURFACE FINISHING
SURFACE PROPERTIES