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Title: Comparisons of GaAs, tungsten, and photoresist etch rates and GaAs surfaces using RIE with CF/sub 4/, CF/sub 4/ + N/sub 2/, and SF/sub 6/ + N/sub 2/ mixtures

Journal Article · · J. Electrochem. Soc.; (United States)
DOI:https://doi.org/10.1149/1.2113660· OSTI ID:6084868

Etch rates for GaAs, tungsten, and photoresist were compared using CF/sub 4/, CF/sub 4/ + N/sub 2/, and SF/sub 6/ + N/sub 2/ gases. Etch rate ratio between the W and photoresist can be increased by N/sub 2/ gas addition, with a negligibly low GaAs etch rate. GaAs surfaces exposed to CF/sub 4/ + N/sub 2/ or SF/sub 6/ + N/sub 2/ plasmas were characterized by means of photoluminescence (PL), Schottky contacts, secondary ion mass spectroscopy (SIMS), and Auger electron spectroscopy (AES). The PL intensity measurements and Schottky characteristics revealed that the damage to the GaAs surface was somewhat smaller than that caused by pure CF/sub 4/ gas. The AES and SIMS measurements showed that the change in Ga/As composition after reactive ion etching was negligibly small. Results of heat-treatment are also described. Curious annealing characteristics were observed in the CF/sub 4/ + N/sub 2/, suggesting the existence of GaN.

Research Organization:
Nippon Telegraph and Telephone Corporation, Musashino Electrical Communication Laboratory, Musashino-shi, Tokyo
OSTI ID:
6084868
Journal Information:
J. Electrochem. Soc.; (United States), Vol. 132:11
Country of Publication:
United States
Language:
English