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U.S. Department of Energy
Office of Scientific and Technical Information

Get the metal out

Journal Article · · CHEMTECH; (United States)
OSTI ID:6074237
 [1];
  1. Rohm and Haas, Spring House, PA (United States). Research and Development Lab.
Wet processes for producing printed circuit boards lead to large volumes of wastewater containing low, but unacceptable, levels of copper ions. This water is usually treated with conventional precipitation technology, which produces hazardous metal hydroxide sludge and an effluent in the low ppm range. These treatment systems are becoming inadequate for printed wiring board (PWB) manufacturers because of the high operating costs, high cost of sludge disposal, and the worldwide trend toward reducing heavy metal discharge limits. Kinetico Engineered Systems, Inc., has developed a treatment for this waste based on ion exchange resin and electrowinning technologies. The program meets copper discharge limits below 1 ppm, recovers copper in a salable metallic form, and recylces 60 to 80 % of the copper-bearing wastes. The process has led to reduced operating costs while meeting regulatory compliance levels reliably.
OSTI ID:
6074237
Journal Information:
CHEMTECH; (United States), Journal Name: CHEMTECH; (United States) Vol. 23:2; ISSN CHTEDD; ISSN 0009-2703
Country of Publication:
United States
Language:
English