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Title: Experimental study of narrow slot, cavity-backed apertures with finite wall conductivity

Conference ·
OSTI ID:6063869

Electromagnetic coupling to electronic components or subsystems is a concern in modern system design. Undesired coupling can cause interference or, in the extreme, system upset. To be able to characterize the coupling is an important step to understanding the limitations on system performance. Often the approach is taken to shield the electronic equipment inside some kind of enclosure. However, there are usually inadvertent cracks or bowing at mechanical interfaces. These gaps are apparent slot apertures. An equivalent antenna/local transmission line model for narrow slot apertures with depth including losses has been developed. It may be applied tortuous paths and hence may be used to model practical situations. This model has been previously verified by measuring the coupling through narrow slot apertures with varying width and depth. These measurements were performed for brass slots radiating into a half-space. The results were in good agreement with the model of Warne and Chen. The models, as well as the measurements showed that for very narrow slots the wall loss becomesdominant -- it has been demonstrated that the inclusion of loss is important in making realistic coupling estimates in practical configurations. This paper presents results showing the effects of varying conductivity and surface preparations for half-space coupling as well as different loadings of the narrow slot apertures. The coupling through narrow slot apertures having depth was measured for a variety of resonant cavity loadings. The loadings were chosen such that the cavity resonant frequencies were above, near and below the resonant peak of the half-space coupling curve. Measurements were made in the 2--4 GHz band with vertical polarization. 3 refs., 6 figs., 1 tab.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
Sponsoring Organization:
USDOE; USDOE, Washington, DC (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6063869
Report Number(s):
SAND-91-0445C; CONF-9106118-2; ON: DE91009039
Resource Relation:
Conference: 1991 Institute of Electrical and Electronics Engineers (IEEE) AP-S symposium, Ontario (Canada), 24-28 Jun 1991
Country of Publication:
United States
Language:
English