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Diorganosilacetylene-alt-diorganosilvinylene polymers and a process of preparation

Patent ·
OSTI ID:6047116

The present invention provides linear organosilicon polymers including acetylene and vinylene moieties, and a process for their preparation. These diorganosilacetylene-alt-diorganosilvinylene linear polymers can be represented by the formula: -[-(R[sup 1])(R[sup 2])Si-C[triple bond]C-(R[sup 3])(R[sup 4])Si-CH[double bond]CH-][sub n]-, wherein n[>=]2; each R[sup 1], R[sup 2], R[sup 3], and R[sup 4] is independently selected from the group consisting of hydrogen, halogen, alkyl, alkenyl, aryl, and aralkyl radicals. The polymers are soluble in organic solvents, air stable, and can be pulled into fibers or cast into films. They can be thermally converted into silicon carbide ceramic materials.

DOE Contract Number:
W-7405-ENG-82
Assignee:
Iowa State Univ. Research Foundation, Inc., Ames, IA (United States)
Patent Number(s):
A; US 5241029
Application Number:
PPN: US 7-817602
OSTI ID:
6047116
Country of Publication:
United States
Language:
English