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Title: Some speculations on the mechanisms of abrasive grinding and polishing

Conference ·
OSTI ID:6042384

The mechanisms of grinding, a predominantly fracture mechanism in brittle material, and polishing, a predominantly plastic shearing mechanism, appear quite different. However, in a number of cases it can be shown that the difference between the two mechanisms can be triggered by differences in depth of cut and abrasive size. This paper will present results from recent polishing research that tend to support a physico-chemical interaction model involving aqueous diffusion, internal hydrolysis, and ion exchange mechanisms that may explain the plastic to brittle transition in silicate materials. The model would seem to have clear implications for both low scatter polishing and fine machining of silicate materials.

Research Organization:
Lawrence Livermore National Lab., CA (USA)
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
6042384
Report Number(s):
UCRL-96159; CONF-8705183-1; ON: DE87014242
Resource Relation:
Conference: 4. international precision engineering seminar, Cranfield, UK, 11 May 1987; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English