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Title: Simulation of the layer-growth dynamics in silver films: Dynamics of adatom clusters and vacancy clusters on Ag(100)

Conference ·
DOI:https://doi.org/10.1117/12.941860· OSTI ID:6042061

Simulation results are presented for some dynamical processes occurring in the growth of (100) layers of silver. The overlayer dynamics are evolved using a recently developed method that, in the regime where surface diffusion consists of discrete hops, yields classically exact dynamics for an arbitrary interatomic potential. The time-scale limitations of direct molecular dynamics simulations are thus overcome. The Ag/Ag(100) system is modeled using a sophisticated form of interaction potential, similar to the embedded atom method, in which the energy is given by a sum of pairwise interactions plus a term for each atom that depends on the local atomic density. This type of potential includes the many-body terms necessary to describe a variety of atomic environments, such as the perfect fcc metal, free surfaces, vacancies, interstitials, and even the diatomic molecule, but with the computational scaling of a simple pair potential. The present study focuses on some of the dynamics in a single layer of silver: the diffusion and dissociation of clusters of adatoms and vacancies. Some interesting features are observed, including a nonmonotonic decrease in diffusion constant with increasing cluster size, and a roughly constant mean square distance a cluster migrates before dissociation (ejection of a monomer). 41 refs., 9 figs., 2 tabs.

Research Organization:
Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
DOE Contract Number:
W-7405-ENG-36
OSTI ID:
6042061
Report Number(s):
LA-UR-87-2807; CONF-8708110-11; ON: DE87014764
Resource Relation:
Journal Volume: 0821; Conference: 31. SPIE annual international technical symposium on optical and optoelectronic applied science and engineering, San Diego, CA, USA, 16 Aug 1987; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English