Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Chlorine reactive ion beam etching of InSb and InAs sub 0. 15 Sb sub 0. 85 /InSb strained-layer superlattices

Journal Article · · Applied Physics Letters; (USA)
DOI:https://doi.org/10.1063/1.104664· OSTI ID:6039145
;  [1]
  1. Sandia National Laboratories, Albuquerque, New Mexico 87185-5800 (US)

We report the first successful application of Cl{sub 2} reactive ion beam etching (RIBE) to the dry etching of bulk InSb and InAs{sub 0.15}Sb{sub 0.85}/InSb strained-layer superlattices (SLSs). Etching was performed in a load-locked ultrahigh vacuum chamber using an electron cyclotron resonance ion source. Etching rates for InSb and InAs{sub 0.15}Sb{sub 0.85}/InSb SLS with a 500 eV Cl{sub 2} beam at 0.6 mA/cm{sup 2} are 280 and 240 nm/min, respectively, compared to 310 nm/min for GaAs. The sputter yield for Cl{sub 2} RIBE in this antimonide system is double that obtained by Ar ion milling under identical conditions.

DOE Contract Number:
AC04-76DP00789
OSTI ID:
6039145
Journal Information:
Applied Physics Letters; (USA), Journal Name: Applied Physics Letters; (USA) Vol. 58:3; ISSN APPLA; ISSN 0003-6951
Country of Publication:
United States
Language:
English