Novel processing of epoxy resin systems

Journal Article · Fri Jan 01 04:00:00 EST 1993 · CHEMTECH; (United States)

OSTI ID:6032470

May, C A ^[1]; Breitigam, W; Bauer, R S

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1. Arroyo Research, Watsonville, CA (United States)

The laminates that are used to prepare advanced composite parts generally require curing at high temperature and pressure, and their raw material shelf lives are limited. The epoxy resin systems that the authors describe here offer the potential of extended shelf life while curing at relatively low temperatures with a method the authors call rapid thermoset processing (RTP). A laminate is formed by stacking the prepreg in a pre-determined manner as required by the end product configuration. The prepreg is then bagged by placing it in a sealed envelope of a heat-resistant film, which is subsequently bonded to a metal surface (the tool) with a heat-resistant vacuum bag putty. The bag has an access hole through which vacuum can be applied to the prepreg stack, facilitating removal of air and other volatiles. This assembly is then heated under vacuum and pressure in an autoclave, the resin melts, and any excess air or volatile matter bleeds from the configuration, resulting in the required dense, void-free laminate.

• OSTI ID: 6032470
• Journal Information: CHEMTECH; (United States), Journal Name: CHEMTECH; (United States) Vol. 23:1; ISSN CHTEDD; ISSN 0009-2703
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360601* -- Other Materials-- Preparation & Manufacture
COMPOSITE MATERIALS
CURING
DIAGRAMS
EPOXIDES
FABRICATION
HEAT TREATMENTS
MATERIALS
MECHANICAL PROPERTIES
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
PHASE DIAGRAMS
VACUUM SYSTEMS