Analysis of the effect of thermal environment on a waste package in tuff
Conference
·
OSTI ID:60011
An activity to support the development of a waste package for a repository in tuff was initiated in FY 1981. Because of the potential complexity of waste packages, we undertook a systems analysis of a reference package in tuff. The studies focused on the thermal environment experienced by the waste package for both spent fuel and reprocessed commercial high-level waste (CHLW) for periods to 1000 years. The purposes of these studies were to: (1) evaluate the package component stability, (2) identify critical areas for research, (3) assess the impact of the waste package on the near-field repository conditions, and (4) provide a basis for extension of the systems analysis to other functional aspects of package performance. The thermal analysis was carried out using COYOTE, a finite-element, conduction code. These and additional calculations raise serious concerns about the effectiveness of the backfill within the context of the total waste package. We have concluded that (1) the repository thermal-load design limit may be fixed by the waste package, not the host rock, (2) for a specific thermal loading, thermal conductivity of the backfull is the most important factor governing thermal profiles in the waste package, and (3) the material selection for the waste package may be site specific. The results of these studies are being used to define future research and development activities for a waste package for a repository in tuff.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 60011
- Report Number(s):
- SAND--81-2165A; CONF-811119--12; ON: DE87002675
- Country of Publication:
- United States
- Language:
- English
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