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Title: Properties of the ablation process for excimer laser ablation of Y sub 1 Ba sub 2 Cu sub 3 O sub 7

Journal Article · · Journal of Applied Physics; (USA)
DOI:https://doi.org/10.1063/1.347380· OSTI ID:5999776
;  [1];  [2]; ; ;  [3]
  1. United States Army, Electronics Technology and Devices Laboratory, Fort Monmouth, New Jersey 07703-5000 (US)
  2. Martin Goffman Associates, 3 Dellview Drive, Edison, New Jersey 08820-2545 (US)
  3. Institute for Physical Science and Technology, University of Maryland, College Park, Maryland 20742 (US)

The process of excimer laser ablation has been studied while varying the laser fluence from 0.237 to 19.1 J/cm{sup 2}. Ion time-of-flight, total charge, target etch depth per pulse, and etch volume per pulse have been measured. Results indicate a maximum ablation volume and minimum ionization fraction occur near 5 J/cm{sup 2}. Several of the parameters measured vary rapidly in the 1--5 J/cm{sup 2} range. Variation in these parameters strongly influences the properties of films grown by this technique.

OSTI ID:
5999776
Journal Information:
Journal of Applied Physics; (USA), Vol. 69:2; ISSN 0021-8979
Country of Publication:
United States
Language:
English