Compatibility stresses in fatigued bicrystals: Dependence on misorientation and small plastic deformations

Journal Article · Mon Dec 01 04:00:00 EST 1997 · Acta Materialia

DOI:https://doi.org/10.1016/S1359-6454(97)00184-5· OSTI ID:599712

Peralta, P; Laird, C ^[1]

---

1. Univ. of Pennsylvania, Philadelphia, PA (United States). Dept. of Materials Science and Engineering

Compatibility stresses are calculated for twist boundaries about [{bar 1}49] and a random high angle boundary between a [{bar 1}49] grain and a [100] grain, assuming piecewise homogeneous elastic fields and copper as model material. The in-plane compatibility stresses produced by uniaxial tension perpendicular to the boundary are a strong function of the crystallography of the grains and their misorientation. The effects of small plastic strains via crystallographic slip are also studied for three particular misorientations ([{bar 1}49] 90{degree} and 180{degree} twist boundaries and the random misorientation) and the type and amount of slip close to the boundary predicted by minimizing the elastic energy and using experimental measurements of the axial component of the plastic strain. The predictions agree quite well with experimental observations of slip traces close to the boundaries of copper bicrystals with those misorientations tested under high cycle fatigue conditions.

• Sponsoring Organization: USDOE, Washington, DC (United States)
• OSTI ID: 599712
• Journal Information: Acta Materialia, Journal Name: Acta Materialia Journal Issue: 12 Vol. 45; ISSN 1359-6454; ISSN ACMAFD
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER
FATIGUE
GRAIN BOUNDARIES
GRAIN ORIENTATION
SLIP
STRESS ANALYSIS