Adhesion in solids; Proceedings of the Symposium, Reno, NV, Apr. 5-7, 1988

Conference · Thu Dec 31 23:00:00 EST 1987

OSTI ID:5948256

Mattox, D M; Baglin, J E.E.; Gottschall, R J; Batich, C D

The present conference on adhesion phenomena in solids discusses topics in fracture mechanics, tribology, postdeposition treatments, deposited inorganic films, the adherence of natural layers and surface treatment of polymers, and analytical techniques. Attention is given to the mechanics of the peel test for thin-film adhesion, the direct observation of friction at the atomic scale, the enhancement of thin-film adhesion by MeV-ion and keV electron bombardment, metal-ceramic interfacial reactions, the adhesion of growing oxides to metallic substrates, polyimide adhesion as a function of substrate structure, the surface characterization of sputter-etched polymer films, photochemical changes of Al films on Si, and thin-film adhesion to ion-bombarded surfaces.

• OSTI ID: 5948256
• Report Number(s): CONF-8804117-
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360200* -- Ceramics
Cermets
& Refractories
360600 -- Other Materials
ABSTRACTS
ADHESION
CERAMICS
CERMETS
CHALCOGENIDES
COATINGS
COMPOSITE MATERIALS
DEPOSITION
DOCUMENT TYPES
ELEMENTS
FILMS
FRACTURE MECHANICS
FRICTION
IMIDES
INTERFACES
LEADING ABSTRACT
MATERIALS
MECHANICS
MEETINGS
METALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC POLYMERS
OXIDES
OXYGEN COMPOUNDS
PETROCHEMICALS
PETROLEUM PRODUCTS
POLYMERS
RESINS
SOLIDS
SUBSTRATES
SURFACE FINISHING
THIN FILMS
TRIBOLOGY