Reduction of Solvent Use Through Fluxless soldering

Conference · Fri Nov 30 23:00:00 EST 1990

OSTI ID:5904099

Hosking, F. Michael ^[1]

---

1. Sandia National Labatory (SNL-NM), Albuquerque, NM (United States)

Conventional soldering typically requires fluxing to promote wetting. Halogenated solvents must then be used to remove the flux residues. While such practice has been routinely accepted throughout the DOE weapons complex, new environmental laws and agreements will eventually phaseout the use of these solvents. Solvent substitution or alternative technologies must be developed to meet these restrictions. SNL, Albuquerque is characterizing and developing alternative fluxless soldering technologies that will reduce solvent use and be compatible with prototypic packaging materials. The program is focusing on controlled atmosphere (vacuum, inert/reducing gas, reactive plasma, and activated acid vapor) soldering, metallization and inhibitor technology, and thermomechanical surface activation (laser, infrared, solid state diffusion, and ultrasonic) soldering. Since there is no universal method that can be applied to every electronic application, the study is defining technological options and limitations. Fluxless soldering would reduce the number of cleaning steps and the subsequent volume of mixed solvent waste. This paper will present an overview of the effects of atmosphere, materials, and processing conditions on attaining a fluxless operation. Examples of applying these technologies to electronic packaging are given.

• Research Organization: Sandia National Labatory (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 5904099
• Report Number(s): SAND--90-2838C; CONF-901285--1; ON: DE91009888
• Country of Publication: United States
• Language: English

Related Subjects

290300* -- Energy Planning & Policy-- Environment
Health
& Safety
36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
42 ENGINEERING
420200 -- Engineering-- Facilities
Equipment
& Techniques
ATMOSPHERES
CARBON TETRACHLORIDE
CHEMICAL REACTIONS
CHLORINATED ALIPHATIC HYDROCARBONS
CONTROLLED ATMOSPHERES
Chlorofluorocarbons (CFCs)
Controlled Atmosphere Soldering
FABRICATION
Fluxes
Fluxless Soldering
GREENHOUSE EFFECT
HALOGENATED ALIPHATIC HYDROCARBONS
HEAT TREATMENTS
JOINING
MATERIALS WORKING
METALLURGICAL FLUX
Metallizations
ORGANIC CHLORINE COMPOUNDS
ORGANIC COMPOUNDS
ORGANIC HALOGEN COMPOUNDS
ORGANIC INSULATORS
Organic Inhibitors
REDUCTION
SOLDERING
SOLVENTS
Solvents
THERMOMECHANICAL TREATMENTS
Thermomechanical Surface Activation Soldering
WELDING