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Electron microscopy of thick 304 SS-copper multilayers

Conference ·
OSTI ID:5889773

Multilayer nano-structures are dense synthetic ultrafine grained high interface concentration solids. Such material are of interest since their unique structures often result in new or enhanced physical properties. In this paper the results of a TEM characterization study of a series of thick 304 Stainless Steel (SS)-Copper (Cu) multilayered structures are presented. Magnetron sputter deposited SS films have a metastable BCC structure with the (110) planes parallel to the substrate. This occurs as the mean energy of an incident adatoms are approximately 9eV; all this energy is absorbed at the deposition surface. The surface of the material passes through the {partial derivative} BCC phase of SS during deposition and this structure is quench stabilized due to the large (>10{sup 10} K/sec.) surface cooling rates. At multilayer periods of {le} 200{Angstrom} the epitaxial growth of SS on a FCC-Cu results in FCC-SS as deposited. Transformation of the FCC-SS to BCC is possibly held in check by coherency strains with the Cu lattice. For periods of {ge} 500{Angstrom} there is a bimodal FCC,BCC-SS structure. The FCC to BCC interface in the SS layer appears to lie at 50--100{Angstrom} from the SS on Cu interface. Since coherency strains are confined to regions near the interface, the retained FCC structure of the SS is limited to this region. The bimodal structure is believed to result from partial transformation of the SS during deposition in the larger period ({ge} 500{Angstrom}) multilayers. 3 refs., 5 figs.

Research Organization:
Lawrence Livermore National Lab., CA (USA)
Sponsoring Organization:
DOE; USDOE, Washington, DC (USA)
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
5889773
Report Number(s):
UCRL-JC-106765; CONF-910872--3; ON: DE91011116
Country of Publication:
United States
Language:
English