skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Isothermal reacting comparison of DGEBA (diglycidyl ether of bisphenol A)-type epoxy resins

Conference ·
OSTI ID:5887022

The trend toward miniaturization of electronic components has prompted the need for materials with improved dielectric properties and decreased tendency to promote corrosion resulting from low levels of ionic impurities. Epoxy resins based on the diglycidyl ether of bisphenol A (DGEBA), which have reduced levels of total, ionic, and/or saponifiable chlorine, have recently been introduced commercially for use in microelectronic applications. These electronic-grade resins have been either manufactured specifically to reduce, or purified to remove, the molecular species that are responsible for the ionic and saponifiable chlorine. Because some of these species have been shown to affect the bulk resin processing parameters, a study was undertaken to compare the reactivities of some electronic-grade resins to the non-electronic-grade materials. This paper presents the results of the DSC kinetic study performed on commercially available DGEBA resins to determine if process changes were required to replace a traditional DGEBA-type resin with a reduced chlorine version. 2 refs., 5 figs., 2 tabs.

Research Organization:
Allied-Signal Aerospace Co., Kansas City, MO (USA). Kansas City Div.
DOE Contract Number:
AC04-76DP00613
OSTI ID:
5887022
Report Number(s):
KCP-613-4113; CONF-8909169-1; ON: DE89015749
Resource Relation:
Conference: 18. North American Thermal Analysis Society conference, San Diego, CA, USA, 24-27 Sep 1989; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English