Low temperature measurement of thermal and mechanical properties of phenolic laminate, the pultruded polyester fiberglass and A and B epoxy putty. [Micarta]

Conference · Sun Dec 31 23:00:00 EST 1978

DOI:https://doi.org/10.1007/978-1-4613-9859-2_30· OSTI ID:5879855

Wang, S T; Kim, S H; Kim, N S; Cheng, R S; Hoffman, J; Gonczy, J

Low temperature measurements were made and are reported of thermal and mechanical properties of phenolic laminate, pultruded polyester fiberglass, and A and B epoxy putty. To determine the modulus, compressive and tensile stress and strain, an Instron machine, a Tinus-Olsen testing machine, a Wheatstone bridge and strain gages were used. (FS)

• Research Organization: Argonne National Lab., Evanston, IL (USA)
• Sponsoring Organization: USDOE
• DOE Contract Number: W-31109-ENG-38
• OSTI ID: 5879855
• Report Number(s): CONF-790815-21
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360303* -- Composite Materials-- Mechanical Properties-- (-1987)
360304 -- Composite Materials-- Physical Properties-- (-1987)
360403 -- Materials-- Polymers & Plastics-- Mechanical Properties-- (-1987)
360404 -- Materials-- Polymers & Plastics-- Physical Properties-- (-1987)
ALDEHYDES
AROMATICS
COMPOSITE MATERIALS
CRYOGENICS
EPOXIDES
ESTERS
FIBERGLASS
FORMALDEHYDE
HYDROXY COMPOUNDS
LOW TEMPERATURE
MATERIALS
MEASURING INSTRUMENTS
MECHANICAL PROPERTIES
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHENOLS
PHYSICAL PROPERTIES
PLASTICS
POLYESTERS
POLYMERS
THERMODYNAMIC PROPERTIES