Intermetallic matrix composites

Conference · Sun Dec 31 23:00:00 EST 1989

OSTI ID:5853897

Anton, D L ^[1]; Martin, P L ^[2]; Miracle, D B ^[3]; McMeeking, R ^[4]

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1. United Technologies Research Center, East Hartford, CT (US)
2. Rockwell International Science Center, Thousand Oaks, CA (US)
3. Wright Research and Development Center, Wright-Patterson Air Force Base, OH (US)
4. Univ. of California, Santa Barbara, CA (US)

This book presents a symposium on the complex processing-microstructure-property relationships in intermetallic matrix composite materials. It may appear to the reader that some of the work reported in this volume does not bear on this question, but it should be remembered that intermetallic compounds have properties similar to both ceramics (at low temperatures) and metals (at high temperatures). Thus the techniques for toughening brittle matrix composites at ambient temperatures as well as those for strengthening ductile matrix composites at elevated temperatures need to be applied to the intermetallic situation. For this reason, the session on microstructure-based modeling of the behavior of intermetallic matrix composites drew heavily on ceramic and metal matrix experience. The session discussing processing was also a mix of ceramic and metallurgical approaches, while stressing novel methods particular to composite microstructures. Thermodynamic compatibility and conventional microstructure-mechanical property studies make up the bulk of the papers as they address a large deficiency in our understanding in this important area.

• OSTI ID: 5853897
• Report Number(s): CONF-900466--; ISBN: 1-55899-083-6
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360601* -- Other Materials-- Preparation & Manufacture
360602 -- Other Materials-- Structure & Phase Studies
360603 -- Materials-- Properties
ABSTRACTS
ALLOYS
CHEMICAL REACTION KINETICS
CRYSTAL STRUCTURE
DOCUMENT TYPES
FABRICATION
INTERMETALLIC COMPOUNDS
KINETICS
LEADING ABSTRACT
MECHANICAL PROPERTIES
MICROSTRUCTURE
REACTION KINETICS