Effects of interfacial films on thermal stresses in whisker-reinforced ceramics

Journal Article · Mon Oct 31 23:00:00 EST 1988 · J. Am. Ceram. Soc.; (United States)

DOI:https://doi.org/10.1111/j.1151-2916.1988.tb07560.x· OSTI ID:5833575

Hsueh, C H; Becher, P F; Angelini, P

Toughening of whisker-reinforced (or fiber-reinforced) ceramics by whisker pullout requires debonding at the whisker/matrix interface. Compressive clamping stresses, which would inhibit interface debonding and/or pullout, are expected in composites where the matrix has a higher thermal expansion coefficient than the whisker. Because such mismatch in thermomechanical properties can result in brittle composites, it is important to explore approaches to modify the thermal stresses in composites. As a result, the effects of a film at the whisker/matrix interface on the stresses due to thermal contraction mismatch upon cooling are considered in this study. Analysis of various properties of the thin film are considered for the whisker/matrix systems, in particular for SiC/Al/sub 2/O/sub 3/, SiC/cordierite, and SiC/mullite composites.

• Research Organization: 9501970
• OSTI ID: 5833575
• Journal Information: J. Am. Ceram. Soc.; (United States), Journal Name: J. Am. Ceram. Soc.; (United States) Vol. 71:11; ISSN JACTA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360203 -- Ceramics
Cermets
& Refractories-- Mechanical Properties
360204* -- Ceramics
Cermets
& Refractories-- Physical Properties
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
BRITTLENESS
CARBIDES
CARBON COMPOUNDS
CHALCOGENIDES
CHEMICAL COMPOSITION
CRYSTALS
FILMS
INTERFACES
MATERIALS
MECHANICAL PROPERTIES
MONOCRYSTALS
OXIDES
OXYGEN COMPOUNDS
REINFORCED MATERIALS
SILICON CARBIDES
SILICON COMPOUNDS
STRESSES
THERMAL STRESSES
THIN FILMS
WHISKERS
YOUNG MODULUS