Lead frame bonder modifications for more uniform production bonding
Lead frame thermocompression bonding is used for the attachment of external gold and nickel plated copper leads which provide electrical contact to hybrid microcircuits. Significant modifications, which included substrate heating, were made to a standard lead frame bonder to determine whether bond strengths could be improved and bond delaminations reduced compared to the bond results produced by a conventional bonder. These conclusions were derived from the study: (1) substrate thin film and lead frame gold plating properties were a stronger determinant of the resultant bond strength and failure modes than the bonder and were a singificant contributor to bond delaminations; (2) heated substrates alone did not produce better bond results than unheated substrates when using the same modified bonder and previously aceptable substrates and lead frames; and (3) a redesigned bonder, with several modifications for more effective heat and pressure control, improved the bond results on marginal substrates.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 5831462
- Report Number(s):
- BDX-613-2246; CONF-791113-1
- Resource Relation:
- Conference: ISHM conference, Los Angeles, CA, USA, 13 Nov 1979
- Country of Publication:
- United States
- Language:
- English
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