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Formation of silicides by rapid thermal annealing over polycrystalline silicon

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.337404· OSTI ID:5822035

We have investigated the formation of titanium silicide by rapid thermal annealing in nitrogen and argon ambients over polycrystalline silicon. A sheet resistance of about 3 ..cap omega.. per square for a 300-A Ti layer was achieved after 900 /sup 0/C/10-s annealing treatment, which decreased to about 2 ..cap omega.. per square after 1100 /sup 0/C/10-s treatment. The silicides were found to be stable during rapid thermal annealing up to 1100 /sup 0/C/10 s with no or negligible migration of titanium along the grain boundaries in polycrystalline silicon. An external layer (titanium rich, mixture of titanium oxide and nitride) was observed to form during rapid thermal annealing treatment in the nitrogen ambient, but the surface remained clean in the argon ambient.

Research Organization:
Materials Engineering Department, North Carolina State University, Raleigh, North Carolina 27695
OSTI ID:
5822035
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 60:2; ISSN JAPIA
Country of Publication:
United States
Language:
English