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A numerical thermal model of the rapid solidification parameters in the capacitor discharge welding process

Conference ·
OSTI ID:5818948
The capacitor discharge (CD) welding process is investigated as a means of joining materials produced by Rapid Solidification Processing (RSP). The rapidly solidified microstructures produced by this process are evaluated and compared with the microstructure of the original RSP materials and a one-dimensional finite element heat conduction model is used to evaluate cooling rates, solidification rates, and temperature gradients near the fusion line. 10 refs., 5 figs., 6 tabs.
Research Organization:
EG and G Idaho, Inc., Idaho Falls (USA); Oregon Graduate Center, Beaverton (USA)
DOE Contract Number:
AC07-76ID01570
OSTI ID:
5818948
Report Number(s):
EGG-M-18186; CONF-870307-24; ON: DE88002206
Country of Publication:
United States
Language:
English