Drive through doping process for manufacturing low back surface recombination solar cells
A method for passivating the back metallization of a solar cell and forming deep impurity doped regions under the back contacts of the solar cell is described comprising the steps of: providing a p-type wafer of semiconductor material with a front and back essentially parallel major surfaces; forming an n + layer under the front major surface of the wafer defining and n/sup +/-p junction between the front and back major surfaces; forming p+ layer under the back surface of the wafer defining a p/sup +/-p junction between the front and back major parallel surfaces, the p/sup +/-p junction and the n/sup +/-p junction defining a p-type layer therebetween; depositing a nonconductive layer on the major surface; depositing a metal paste in a predetermined pattern onto the exposed major surface of the nonconductive layer; heating the wafer and the metal paste to a predetermined temperature so that the metal paste will oxidize, and cooling the wafer to form p/sup +/ type impurity doped regions in a predetermined pattern extending from the back surface of the wafer into the wafer to a predetermined depth.
- Assignee:
- Spectrolab, Inc., Sylmar, CA
- Patent Number(s):
- US 4703553
- OSTI ID:
- 5813798
- Resource Relation:
- Patent File Date: Filed date 16 Jun 1986
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
N-TYPE CONDUCTORS
FABRICATION
P-TYPE CONDUCTORS
SOLAR CELLS
COOLING
CRYSTAL DOPING
DEPOSITION
HEATING
LAYERS
METALLURGICAL EFFECTS
METALLURGY
P-N JUNCTIONS
PASSIVATION
DIRECT ENERGY CONVERTERS
EQUIPMENT
JUNCTIONS
MATERIALS
PHOTOELECTRIC CELLS
PHOTOVOLTAIC CELLS
SEMICONDUCTOR JUNCTIONS
SEMICONDUCTOR MATERIALS
SOLAR EQUIPMENT
140501* - Solar Energy Conversion- Photovoltaic Conversion
360601 - Other Materials- Preparation & Manufacture