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U.S. Department of Energy
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Room temperature and elevated temperature deformation characteristics of inconel X-750. [Room temperature to 816/sup 0/C]

Technical Report ·
OSTI ID:5805643

Thin foil electron microscopy techniques were used to characterize the dislocation behavior of Inconel X-750 tensile specimens tested at temperatures ranging from room temperature of 1500/sup 0/F (816/sup 0/C). Operative dislocation mechanisms were related to the fracture surface morphologies and the overall tensile response of this nickel-base alloy. Under room temperature and intermediate temperature conditions, a rather extensive dislocation substructure throughout the matrix was associated with the ductile response exhibited by Inconel X-750. In the higher temperature regime, approximately 1200 to 1300/sup 0/F (649 to 704/sup 0/C), all dislocation activity was channeled through narrow slip bands which subsequently initiated localized separation and a very faceted fracture surface appearance. The absence of a homogeneous dislocation substructure in this temperature regime resulted in a severe degradation in ductility levels. At the highest test temperature, 1500/sup 0/F (816/sup 0/C), a uniform dislocation network throughout the Inconel X-750 matrix coupled with intense dislocation activity adjacent to the grain boundaries resulted in a marked improvement in ductility.

Research Organization:
Hanford Engineering Development Lab., Richland, WA (USA)
DOE Contract Number:
EY-76-C-14-2170
OSTI ID:
5805643
Report Number(s):
HEDL-TME-79-10
Country of Publication:
United States
Language:
English